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Semiconductor Thermal Reliability .pdf


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Semiconductor Thermal Analyzers perform thermal measurements on packaged semiconductor
devices using the electrical method of junction temperature measurement. These thermal tests
include steady-state thermal resistance, transient thermal impedance, and die attach quality
screening. Component test services are available for semiconductor thermal characterization of
customer devices at our factory test-laboratory.

Analysis Tech Inc. is a designer, manufacturer and global supplier of electronic instruments
associated with reliability testing of electronic packaging. Founded in 1983 and headquartered ten
miles north of Boston, Massachusetts, Analysis Tech has developed instruments that have traced the
evolution of electronic packaging technology. For example, in 1983, surface-mount technology was
experiencing a huge growth-surge due to the higher density board-designs that became possible.
This caused two related changes:
 "Tighter" packaging meant higher heat flux densities which threatened to increase
semiconductor component temperatures and shorten component life.
 The higher mechanical stresses in surface-mount solder joints (compared to through-hole)
threatened to hasten the mechanical fatigue/fracture failure of the solder joints.
Both of these changes increased the potential for lower reliability. To overcome this, reliability
testing has grown with the progressive evolution of new packaging technology which has been
trending toward "denser and hotter".
Analysis Tech product offerings currently focus on two fundamental electronics-failuremechanisms: elevated semiconductor temperatures and mechanical-stress fatigue/fracture of
electrical interconnects. Our test instruments and their operating features have evolved in direct
response to customer needs.

The Calibration Oven provides an alternative to the Calibration Bath for calibrating semiconductor
devices to be tested with Analysis Tech Thermal Analyzers, and is the preferred method for
junction-calibration of power modules or other devices that would be contaminated by oilimmersion in the Calibration Bath. It offers accurate measurement of the device temperature
sensitive parameters, a critical requirement for electrical-method junction temperature
measurement . The temperature of the oven is controlled by the Thermal Analyzer and provides a
safe and convenient method for calibrating as many as eight devices at once. Once initiated, data
collection continues automatically without operator attention.

Features





Automated temperature-controlled device-calibration
Internal dimensions: 12"wide x 10" x 10"
Two stainless steel shelves, adjustable
Complete instructions and warranty

Dimensions
Max. Temperature
Power Consumption
Weight

19" H x 14 W x 12 " D
200 C
800 W
42 lbs

The Analysis Tech Rjc Liquid-Power-Module Test Fixture is a semi-custom, high-performance liquidcooled heat sink for thermal testing of high-power modular-devices at dissipations of more than
3500 watts. This fixture is ideally suited for measuring junction-to-case thermal resistance and
impedance on large power-module packages of all device types including IGBT mixed-modules, full
and half bridges modules, and large MOSFET modules. Temperature controlled coolant water must
be supplied to the fixture from a recirculating chiller. Each test-head is uniquely designed for a
particular set of package dimensions although test heads are easily interchangeable with drip-free
liquid connectors. Thus, this fixture base functions are a universal base for any package-specific Rjc
Liquid-Power-Module test head.

Analysis Tech Thermal Analyzer PWB Adapter Cards comprise a
portion of the electrical interface between the Phase 10 Thermal
Analyzer fixturing (Still Air Box, Wind Tunnel, JEDEC Heat Sunk
Fixtures, etc.) and the DUT (device-under-test). PWB Adapter Cards
provide a convenient means of connecting to the electrical signals
from the Phase 10 Thermal Analyzer required for device powering
and junction temperature sensing. For board mounted components
(typically IC's), the Adapter Card is mounted directly to the Thermal
Test Coupon to which the part is mounted. For discrete components
(typically power devices), the Adapter Card is connected to the DUT
by short hook-up wires.
Thermal Analyzer PWB Adapter Cards are available in two varieties;
General Purpose Adapter Cards, and Device Specific Adapter Cards.
The General Purpose Adapter Card is intended for DUT's that do not
require external discrete components (resistors, capacitors, diodes,
etc.) for device powering, and the Device Specific Adapter Card is
intended for DUT's that require these components. Device Specific
Adapter Cards can be ordered from Analysis Tech pre-wired for the
individual device types that you want to test! Contact the Analysis
Tech technical staff for more information.

Figure 1. General Purpose
PWB Adapter Card

Figure 2. Device Specific
PWB Adapter Card

The Analysis Tech Rjb Thermal Test Fixture embodies the JEDEC standard
51-8 for measuring the junction-to-board thermal resistance, Rjb. The fixture
accommodate either the small or large JEDEC standard thermal test coupon
sizes. The two piece design affords easy board loading and test setup
modification. Note: the photo shows the fixture with the heat
insulation/shields removed.
This fixture clamps on both sides of a JEDEC-board. Thermal connection with the board is through a
opposing pair of square-ring conductive jaws. These jaws contact the board and extract all of the
heat generated by the component and rejects it into the liquid cooled body of the fixture. A
thermocouple in a via placed at the middle-edge of the component body provides the reference
temperature for this test. (Note: test PWBs are not included with this fixture.)
The coolant requirements for this test fixture are fairly minimal: at least 1 gpm (4 lpm) with a
cooling capacity of at least 100 watts at a set point of 18C. Coolant lines are provided with 1/8 NPT
connectors.
Dimensions
Weight

8" H x 6" W x 3" D
6 lbs

The Analysis Tech Phase 12 Thermal Analyzer provides comprehensive automated control of
semiconductor thermal measurements for production and development testing with powerful
features such as:

All Test Modes:
 Testing all devices: diodes, LEDs, bipolar, MOSFET, IGBT, functional IC, thryistors, test dies
 Full 3-terminal and 2-terminal test modes for MOSFETs, IGBTs, bipolars
 Automated high speed data collection, reduction, and analysis for transient and steady state
data
 Transient RC models generated directly from measured junction temperature heating/cooling
 Compatible with all 750E Mil Stds and JEDEC 51 Series methods
 Rjc measurement with JEDEC 51-14 transient method
 Transient data plots for all test parameters in all tests modes
 Simple, automated instrument-calibration procedures
 Multiple text and graphics file formats for convenient exporting
 Continuous intelligent monitoring for errors and data validity
 Kelvin (4-wire) connections to eliminate test cable resistances effects
 Selection of automatic power-control by current, wattage, and ΔTj
 Standard and custom test fixturing available
 Windows 7 operating system

For more information please visit
http://www.analysistech.com


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