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Flip Chip Technology Market to be at Forefront by 2025
Flip Chip Technology market is increasing at a progressive growth rate due to increasing usage for
IC packaging and others. These Flip Chip Technology are specially used for processors of
mainframe computers, personal computers, servers, notebooks, smartphones, tablets, games and in
other devices. Moreover, the advancements in high-density and low-cost package substrates are
encouraging the usage of Flip Chip Technology. The use of flip chips is so great worldwide that
they have become an integral part of electronic component design and assembly
Flip Chip Technology was introduced by IBM Corporation in 1960 for supporting their solid logic
technology. Later on, this Flip Chip technology was adopted by other companies for processors of
PCs and other. Moreover, these Flip Chip technology is used in consumer based products such as
computer peripherals, mobile phones, digital cameras, and MP3 players. This Flip Chip Technology
is a kind of semiconductor device which is used to include solder bumps over the connection pads
of the IC or micro electromechanical system (MEMS). Flip Chip technology allow wireless
installation due to which mostly manufacturers use these Flip Chips. The Flip Chip technology
helps in easing production process and quality management.
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Flip Chip Technology Market: Drivers and Challenges
The major factor driving the adoption of Flip Chip Technology is the increasing need of these Flip
Chip Technology among consumer electronic devices such as watches, smartphones, PCs and
others. These Flip Chip Technology have also became a part of advance equipment due to which the
usage of Flip Chip Technology has increased among other manufacturers.
The key challenge is the cost of flip chips stem from wafer fabrication vendors, substrate vendors,
and assembly/packaging subcontractors. The increased costs are realized at every step of the
process from re-passivation and redistribution (RDL) at wafer fabrication, to the high-performance
multilayer organic build-up substrates provided by the substrate vendor. With the added costs of
assembly, the flip chip package becomes a cost-prohibitive option.
In March, 2014— Honglitronic has launched its new LED model “X-CHIP 2016”, high power
versions of 1W and 3W LEDs. It is designed for various backlight applications, especially TV
backlighting, tablet panel backlighting and flashlight of cell phones etc.
In May 2015, Samsung Electronics introduced the LM301A, a flip-chip-based mid-power LED
package that can operate at anywhere from 0.2 watts to 1 watt — providing a wide range of current
options, resulting in much improved light efficacy. The package was announced at a press
conference, in conjunction with LIGHTFAIR International 2015.
In Flip Chip Technology market there are many players some of them are IBM, Intel Corporation,
Samsung Electronics’ and others.
Presently, North America and Europe is holding the largest market share for Flip Chip Technology
market due to presence of large manufacturer and advance technology providers and market players
in these region. Moreover the advantages of using Flip Chip Technology in navy, and consumer
electronic industry has encouraged used to adopt this Flip Chip technology technology.
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